Pacific 2008 VOC Free flux This 100% VOC-free, water based no-clean formula evaporates completely during the soldering process. It is user friendly, producing no toxic fumes, no annoying odours and no ‘dry skin’ effects as with alcohol based formulae. Due to being water based this flux reduces the maintenance requirements of spray fluxers. It is easy to clean with a damp cloth and requires no aggressive cleaners. Operators are more inclined to maintain the soldering machine properly, resulting in a more stable production process.
Being water based, Pacific 2008 is non-flammable and therefore has no special storage or transportation requirements. It is obviously safer in use than alcohol based fluxes eliminating the possibility of machine fires often caused by over applied flux dropping onto pre-heater elements. Pacific 2008 is equally suited to normal or inerted soldering atmospheres.
The lack of any synthetic residues overcomes contact problems (ICT, connectors, carbon contacts …). It is compatible with all common board finishes including HAL and Organic coatings (OSPs). Being less searching then solvent based fluxes Pacific 2008 does not penetrate as deeply into the solder mask, eliminating the compatibility and residue issues raised by improperly applied solder masks.
Compared to alcohol based fluxes, the consumption of Pacific 2008 has been shown to fall by up to 50% making it far more economical in use.
Pacific 2008 is suitable for application through spray fluxers and by dipping.
Pacific 2010F VOC Free flux A water based 100% VOC free flux with similar properties and benefits to Pacific 2008 but can be applied through a foam fluxer as well as by spray fluxing and dipping.
IF 2005M No Clean Flux One of the very first no-clean, halide free fluxes on the market, still in use in many "high end" applications because of its remarkable performance. IF2005M uses INTERFLUX No Residue ™technology … Activated Solvent Complex (ASC) and contains no synthetic resins.
Ideal for high end, automotive, medical and military applications, IF 2005M is approved to MIL-F-14256F and is compatible with all PCB finishes and solderability preservation coatings.
TS 18 No Clean Flux A halide-free, no-clean, low solids flux that leaves a minimal, barely visible, tack-free, non- corrosive residue. The flux chemistry is compatible with solvent based cleaning, offering the possibility of easy residue removal for specific customer requirements. Recommended for CEM applications where cost is critical.
TS 33 No Clean Flux A halide-free, no clean flux with slightly higher solids content for more difficult to solder jobs and lower solderability board finishes such as electroless nickel gold and nickel palladium. Also suitable for use on bare copper.
Solder Wave Oil D179 Solvent soluble wave oil for dross reduction.
Water Soluble Solder Wave Oil D180 Water soluble wave oil for dross reduction.
Flux Pens No-clean fluxes in a disposable pen, ideal for rework.
Refillable Fluxpen + IF8001 Ideal for SMD repair and selective soldering. Leaves minimal or no residue after reflow.
IF 8300 BGA Fluxpaste A transparent tacky flux formulated for attaching soft ball BGAs. Leaves minimal, non- corrosive post reflow residues.
Lectro Lotion ESD safe hand lotion that protects the skin but does not affect solderability and leaves no corrosive residues.
Solderbath Treatment Treatment to reduce oxidation and minimise drossing in the solder bath. All alloy within the dross is re-utilised and only the impurities are removed saving between 30% and 70% in solder consumption.
Titration Kit An easy to use system for checking the activity of a flux by identifying the solids content.
Foam Fluxers, Spray Fluxers and Air Knives Adapted to meet the needs of no clean processing for minimal evaporation, and improved process stability. Can be retrofitted to most machines.
